DAT BOSS MIX LR antenna High-VHF/UHF (Repack Ready)
Long-range Intelligent antenna with the BOSS Tech system. Specially designed for quality reception of mixed High-VHF/UHF under extremely difficult reception conditions thanks to its design and optimizing the rejection of interference from other frequency bands. It includes a filter to optimize LTE band rejection up to channel 36 (Repack Ready).
The antenna design provides the base UHF structure with three elements (dipole and two reflectors) specifically designed for High-VHF, thus allowing a combined reception of both bands.
The antenna is provided with a high-performance switch-mode power supply to complement the BOSS system, with a compact and pleasing design. Enjoy top rated OTA HDTV shows for free and ensure your installation is ready for NextGen TV (ATSC 3.0).
- Use this antenna to join the "cord-cutting" movement and enjoy top rated HDTV shows for free: abc HD, CSO HD, FOX HD, PBS HD, the CW, Univision HD ...
- High dynamic range: it allows the reception of high-quality TV in a variety of critical situations, from areas where signals are very weak to installations with high signal levels
- Expanded DTT coverage area: up to 27% higher than previous models, allowing the caption of signals distributed over 100 miles
- More stable signal reception: it supports signal variations or fading with no effect on the TV installation
- Optimal C/N: thanks to a very low noise figure that enhances the received signal quality
- Very high gain: TForce technology provides BOSS with an increase in gain
- The DAT design, based on 3 Yagi antennas with asymmetric directors, provides great directivity as well as an optimal anti-echo radiation pattern
- Special double-U dipole: it's open/close format provides optimal frequency response flatness
- A fully shielded switch box protects the BOSS system from impulsive noise; grounded for full protection against electrical discharge
- Manufactured in aluminium (stainless) for a long service life
- Fully automated manufacturing in Europe under the most stringent quality controls: a synonym of high reliability
- Two work mode options: Intelligent low power consumption mode or passive mode (lack of power supply).
TForce technology:
Televes transitions from the traditional silicon era into a new era of electronic component design, allowing integrated circuits to be precisely manufactured for microwave frequency bands. Utilizing “State of the Art” MMIC technology TForce is manufactured using semiconductor compounds such as gallium arsenide (GaAs), providing the resulting products with unparalleled features and performance
Televes has reinvented the antenna concept. Until now, an antenna was just the reception component of a TV installation in which gain and directivity were the main features. The introduction of a smart device like BOSS provides the antenna with the capacity to receive very weak signals without the risk of being affected by very strong signals, the result is a dynamic balance between weak and strong signals that provides optimum signal levels at all times: the "dynamic range" concept turns out to be the most outstanding among quality parameters.
The creation of TForce with BOSS technology using MMIC components is an extraordinary milestone in the optimization of the dynamic range. The technology that allowed the reception of lost signals from distant satellites is now allowing the enhancement of the coverage range in DTT installations.
Bands |
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Frequency range | MHz |
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Channels |
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Gain | dBi |
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Output level |
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Powering |
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Max. current |
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Beamwidth | º |
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F/B ratio | dB |
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Wind load (@130Km/h) | N | 182.4 | |||||||
Wind load (@150Km/h) | N | 250.8 |
*1 The gain is automatically adjusted according to the level of output
*2 The gain is automatically adjusted according to the level of output
Physical data
Net weight: 4,300 g
Gross weight: 5,200 g
Width: 2,130 mm
Height: 735 mm
Depth: 863 mm
Packing
Box 1 Units
Box 1 Units
Pallet 20 Units
tlv_tags | TForce technology:Televes transitions from the traditional silicon era into a new era of electronic component design, allowing integrated circuits to be precisely manufactured for microwave frequency bands. Utilizing “State of the Art” MMIC technology TForce is manufactured using semiconductor compounds such as gallium arsenide (GaAs), providing the resulting products with unparalleled features and performance Televes has reinvented the antenna concept. Until now, an antenna was just the reception component of a TV installation in which gain and directivity were the main features. The introduction of a smart device like BOSS provides the antenna with the capacity to receive very weak signals without the risk of being affected by very strong signals, the result is a dynamic balance between weak and strong signals that provides optimum signal levels at all times: the "dynamic range" concept turns out to be the most outstanding among quality parameters. The creation of TForce with BOSS technology using MMIC components is an extraordinary milestone in the optimization of the dynamic range. The technology that allowed the reception of lost signals from distant satellites is now allowing the enhancement of the coverage range in DTT installations. |
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tlv_tabla_especificaciones |
*1 The gain is automatically adjusted according to the level of output *2 The gain is automatically adjusted according to the level of output |
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tlv_ean | 8424450247037 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_x | 2,130 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_x_label | Width | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_x_unit | mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_y | 735 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_y_label | Height | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_y_unit | mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_z | 863 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_z_label | Depth | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_dim_product_z_unit | mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_weight_product_label | Main product weight | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_weight_product | 0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_weight_product_unit | g | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_gross_weight_label | Gross weight | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_gross_weight | 5,200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_gross_weight_unit | g | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_net_weight_label | Net weight | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_net_weight_unit | g | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_net_weight | 4,300 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_1_type_pack | Box | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_1_type_pcs_pack | Units | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_1_pcs_pack | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_2_pcs_pack | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_2_type_pack | Box | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_2_type_pcs_pack | Units | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_3_pcs_pack | 20 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_3_type_pack | Pallet | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
tlv_3_type_pcs_pack | Units |