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TForce microchip designed and mounted in Televes facilities in Spain TForce technology marks a milestone and proves the tech group´s capacity as a key player in the future of microelectronics in technological sectors such as Defense, aeronautics and automotive. Santiago de Compostela and Campinas, November 30th, 2021 - In the midst of the global component supply crisis, Televes Corporation announces an important milestone by launching its three millionth microchip to the market. And coinciding with this milestone, one of the key firms within the corporation, Maxwell Applied Technologies, also announces that it is already working on the next generation of integrated circuits, based on gallium nitride, opening a new line of infinite possibilities in the field of radio frequency for othe[...]

Through this technology partnership, DWDM solutions based on Padtec developments will become part of the Televes product portfolio for its new Optical Transport business area Santiago de Compostela and Campinas, June 16th, 2021. Televes – Spanish leading multinational in solutions for telecommunication infrastructures, announces its partnership with Padtec, principal manufacturer of optical transport systems in Latin America. The objective is to jointly achieve a position of reference in the Optical Transport sector in Europe, Middle East and Africa (EMEA) markets. Through this alliance, DWDM (Dense Wavelength Division Multiplexing) solutions based on Padtec developments will become part of the Televes product portfolio for its newly created Optical Transport business area for high[...]

No âmbito do atual cenário de surto de COVID-19, a Televes implementou um Plano de Contingência procurando garantir a segurança de colaboradores, clientes e parceiros. Estas medidas incluem: Redução ao mínimo as reuniões presenciais entre colaboradores, clientes e parceiros, prevalecendo a utilização da videoconferência e todas as outras ferramentas disponíveis. Limitação do número de colaboradores na sede da empresa, adotando medidas de teletrabalho. As reuniões presenciais e visitas comerciais serão restringidas passando preferencialmente a serem efetuadas por telefone, e-mails ou outro meio tecnológico disponibilizado. Concernente aos serviços de atendimento telefónico, estes poderão sofrer alguma limita[...]

Televes will be in Cologne to participate in ANGACOM, the German trade fair for Broadband, Cable and Satellite sectors, a key strategic event in Europe. It will be held between 7 and 9 June, with more than 450 exhibitors from 40 countries and a congress with 26 technological panels, in which our technical director Justo Rodal will present the definition of an Intelligent Building as an intrical part of a Smart City.  Once inside Televes Stand D21, visitors will learn about the new manufacturing revolution: TForce, the technology developed by Televes to design, manufacture and assemble MMIC components. With this technology, available to very few manufacturers, the company gives a qualitative leap in electronic minitaturization and will develop a new generation of products with limits onl[...]